Tag Archives: TSMC
TAIPEI (Reuters) – A computer virus outbreak has hit third-quarter results at Taiwan Semiconductor Manufacturing Company Ltd, the world’s largest contract chipmaker, the company said on Sunday.
A logo of Taiwan Semiconductor Manufacturing Co (TSMC) is seen at its headquarters in Hsinchu, Taiwan October 5, 2017. REUTERS/Eason Lam
On Saturday, TSMC, a major supplier for Apple Inc, said that a number of its computer systems and fab tools had been infected by a virus, but the problem had been contained.
The company expects full recovery on Aug. 6, the company said in an updated statement on Sunday.
“TSMC expects this incident to cause shipment delays and additional costs. We estimate the impact to third quarter revenue to be about three percent, and impact to gross margin to be about one percentage point,” it said.
“The Company is confident shipments delayed in third quarter will be recovered in the fourth quarter 2018, and maintains its forecast of high single-digit revenue growth for 2018 in U.S. dollars given on July 19, 2018.”
The chipmaker has notified its customers and is working with them on the wafer delivery schedule. Details will be provided to each customer individually over the next few days, it said.
The virus outbreak occurred during the software installation for a new tool, which caused a virus to spread once the tool was connected to the company’s computer network, TSMC said.
“Data integrity and confidential information was not compromised. TSMC has taken actions to close this security gap and further strengthen security measures,” it said.
Reporting by Jess Macy Yu, editing by Larry King
HSINCHU, Taiwan (Reuters) – Taiwan Semiconductor Manufacturing Co Ltd, a supplier to Apple Inc, said on Thursday it expects to invest $ 25 billion in 5 nanometer node technology.
The firm did not provide a time frame for the investment.
Reporting By Jess Macy Yu; Writing by Anne Marie Roantree; Editing by Stephen Coates
TAIPEI (Reuters) – Taiwan Semiconductor Manufacturing Co (2330.TW), the world’s largest contract chipmaker, is planning a T$ 400 billion ($ 13.50 billion) investment to expand its research and development capacity for future technologies, a company spokeswoman said on Friday.
The initial planned investment is a “ballpark figure” and is for several years down the line, Elizabeth Sun told Reuters in a phone call.
The proposed investment is subject to the government’s ability to procure and integrate more land into the Hsinchu science park in Taiwan, which is currently full, as well as to environmental assessments, Sun added.
Hsinchu serves as the company’s headquarters, a major production facility, and its research and development center, which focuses on future chip technology.
“This piece of land, if we’re able to acquire it, it would be for all the future R&D activities,” Sun said. “Right now we’re already doing 5 nanonmeter R&D. In the future, it’ll be 3 nm and beyond.”
Earlier this month, TSMC revised its full-year revenue target to the low end of its earlier forecast due to softer demand for smartphones and uncertainty in cryptocurrency mining market.
At the same time, it said it expects high-performance computing chips to make up a greater share of the company’s growth over the next five years. The chips are used in such quick-growing fields as artificial intelligence, cryptocurrency mining and blockchain.
($ 1 = 29.6380 Taiwan dollars)
Reporting by Jess Macy Yu; Editing by Kim Coghill